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user guide part number: ZLE60400 revision number: 1.0 issue date: november 2006 ZLE60400
ZLE60400 user guide table of contents 2 zarlink semiconductor inc. 1.0 description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 1.1 device placement . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 1.1.1 p1-amc card edge . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 1.2 switches . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 1.2.1 sw1- zl60304 configuration. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 1.2.2 sw3- handle . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 1.2.3 sw4- manual reset . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 1.3 connectors . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 1.3.1 j6 - debug connector . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 1.3.2 j2 - jumpers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 1.3.3 j3 - jumpers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 1.3.4 j1 - mmc jtag . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 1.3.5 j5 - aux power . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 2.0 ZLE60400 hardware design& architecture . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 2.1 general description. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 2.2 physical specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 2.3 mmc subsystem . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 2.4 supplied and optional accessories. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 3.0 ZLE60400 connectivity & configuration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 3.1 field configuration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 3.1.1 bypass (mmc control disable) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 3.1.2 spare . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 3.1.3 mmc flash write enable (not) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 3.1.4 eerpom write enable . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 3.1.5 sw1 dip switches . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 4.0 ZLE60400 schematic . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
ZLE60400 user guide list of figures 3 zarlink semiconductor inc. figure 1 - ZLE60400 board . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 figure 2 - ZLE60400 layout . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 figure 3 - block diagram of the ZLE60400 board . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 figure 4 - amc edge card pin location . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
ZLE60400 user guide list of tables 4 zarlink semiconductor inc. table 1 - switch 1 settings. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 table 2 - j6 debug connector . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 table 3 - j2 jumper settings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 table 4 - j3 jumper settings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 table 5 - j1 jumper settings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 table 6 - j5 pinouts . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 table 7 - switch 1 settings. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
ZLE60400 user guide 5 zarlink semiconductor inc. 1.0 description the ZLE60400 card provides atca and microtca system interconnect in a hot pluggable, standard advanced mezzanine card form factor. the card features two (2) zarlink zl 60304 4-port optical transceivers for el ctro-optical conversion of the amc signals for transmission up to 100 meters over widel y available parallel ribbon fiber. the card delivers up to 25 gbps of bandwidth across eight in dividual ports operat ing at 3.125 gbps. the zl60304 optical devices, which provide these connectio ns, are stateless with regard to the connection. they have no serdes clock inputs and perform no srio lane traini ng. what arrives at the optical input is passed to the corresponding srio lane, and vice versa. if two ZLE60400 cards are used to connect switches on two carrier board devices, the switches on those carriers will be training against each other as if the zl e60400 cards and opt ical cables were not present. figure 1 - ZLE60400 board
ZLE60400 user guide 6 zarlink semiconductor inc. 1.1 device placement refer to figure 2 for location of the devices referenced below: figure 2 - ZLE60400 layout 1.1.1 p1-amc card edge the amc card edge connector (p1) is to the left in this figure. p1 is inserted into the socket on a carrier board to provide power and signals. the complete details of the amc connector are beyond the scope of this document (refer to appendix a for pin-outs). the main connections used by this board include: ? hot swapping, variable pad lengths ? power management, +3.3 volts on one pin, (always on) ? target power, 12 volts on several pins, switched on after i 2 c messaging ? logic to allow the carrier board to detect insertion ? logic to allow the carrier boa rd to reset the inserted card ?an i 2 c bus to allow the carrier board and inserted card to exchange configuration, status and command messages ? global address detection logic used to assign an i 2 c address to the inserted card based on the carrier board socket used ? amc ports 4-7 connected to the u1 zarlink device ? amc ports 8-11 connected to the u2 zarlink device
ZLE60400 user guide 7 zarlink semiconductor inc. 1.2 switches switches sw1, sw3 and sw4 will be explained in detail in this section. 1.2.1 sw1- zl60304 configuration each of the zl60304s have configuratio n options. if the bypass jumper (connecto r j2, pin 3 to 4) is present, these switches control the configuration options. table 1 details the settings for the appropriate zarlink device. normal operating positi on for these switches are 2 and 6 down and 3, 4, 7 and 8 up. 1.2.2 sw3- handle this switch is mechanically extended from the front panel to the board. see figure 1, as sw itch is on the front panel. sw3 provides a direct input to the mmc. during normal oper ation, the end-user would use this switch to signal an intention to remove the card from a carrier board. the mmc would notify the carrier board and all use of the card would be terminated. target power woul d be shut off and the carrier board would send a message back to the mmc (which would continue to run on management power) telli ng it to indicate shutdown by use of the leds. this function is currently not implemen ted in this release of mmc software. 1.2.3 sw4- manual reset sw4 is a manual push-button located in the upper rear portion of the board. after power on, the mmc and zl60304 devices are reset automatically. pressing this button causes another reset. the effects are identical to those caused by the amc enable signal. switch down/closed up/open 1 not connected not connected 2 u1 tx-dis false u1 tx-dis true 3 u1 sq_en false u1 sq_en true 4 u1 rx_en false u1 rx_en true 5 not connected not connected 6 u2 tx-dis false u2 tx-dis true 7 u2 sq_en false u2 sq_en true 8 u2 rx_en false u2 rx_en true table 1 - switch 1 settings
ZLE60400 user guide 8 zarlink semiconductor inc. 1.3 connectors 1.3.1 j6 - debug connector this connector provides a front panel connection to t he mmc serial port and auxiliary zl60304 pins. the mmc software configures the seri al port to operation at 38,400 8n1. the auxiliary zl60304 pi ns are not defined at this time. table 2 below defines the signals av ailable at the debug connector. 1.3.2 j2 - jumpers these jumpers control the mmc flas h write enable and mmc bypass mode. when bypass is active, the mmc cannot control the zl60304 rese t or configur ation signals. 1.3.3 j3 - jumpers these jumpers provide a mmc software opti on bit and control t he eeprom write enable. pin # signal pin # signal 1gnd 7u2-e10 2 u1-f10 8 u2-d10 3u1-e10 9gnd 4 u1-d10 10 serial in 5 gnd 11 serial out 6u2-f10 12gnd table 2 - j6 debug connector pin # jumper no jumper 1 & 2 mmc flash read only mmc flash is read and write 3 & 4 mmc bypass active mmc has zl reset and configuration control table 3 - j2 jumper settings pin # jumper no jumper 1 & 2 option = 0 option = 1 3 & 4 eeprom is read and write eeprom is read only table 4 - j3 jumper settings
ZLE60400 user guide 9 zarlink semiconductor inc. 1.3.4 j1 - mmc jtag mmc software is installed using the jtag signals at this connector. the jtag chain consists of only the mmc device. caution: failure to follow this caution may result in possible damage to the board. the arrangement of this table matches what is seen if looking at the top side of the card with the amc edge seen in figure 2. 1.3.5 j5 - aux power in normal operation, power is provided through the amc edge connector. the j5 connector allows the card to be operated without a carrier board during debug/testing, mmc software development or the set up of mmc configuration application programs. caution: failure to follow this caution may result in possible damage to the board. do not use this connector when the card is connect ed to a carrier board via the amc edge connector. caution: failure to follow this caution may result in possible damage to the board. do not power the card with target 12 volts on and without management 3.3 volts. caution: failure to follow this caution may result in possible damage to the board. the arrangement of this table matches what is seen if looking at the top side of the card with the amc edge seen in figure 2. pin # signal pin # signal 2gnd 1tck (in) 4 gnd 3 trst_n (in) 6gnd 5tdo (out) 8 ipmi_3v3 7 card_reset (in) 10 gnd 9 tms (in) 12 md2n_vcc (in) 11 tdi (in) 14 gnd 13 reset_detect (out) table 5 - j1 jumper settings pin # power & control pin # power & control 4 gnd 1 gnd 5 management 3.3 volts 2 enable_n 6 target 12 volts 3 target 12 volts table 6 - j5 pinouts
ZLE60400 user guide 10 zarlink semiconductor inc. the card may be powered with only management 3.3 volts. this mimics the condition of a card that has been inserted into a carrier board but has not yet received its target power. the card may be reset by raising then lowering enable_n. this mimics the carrier board's ability to reset the card via the amc ipmi interface. during debug, pin 2 must be pulled to gnd. 2.0 ZLE60400 hardware design& architecture 2.1 general description some of the features of the ZLE60400 are: ? 2 zl60304 4-port optical transceivers ? interoperability ?rapidio ? 25 gbps total bandwidth ?jtag interface ? mmc control for ipmi ? local power option for stand alone operation ? half/full height, single width size amc slot 2.2 physical specifications board size 180 mm x 74 mm power requirement 12 vdc operating temperature ? standard version 0 - 50 c ? extended version tbd standards compliance amc.0 amc.1 amc.4 weight 425 g rohs compliant
ZLE60400 user guide 11 zarlink semiconductor inc. figure 3 - block diagram of the ZLE60400 board 2.3 mmc subsystem the mmc subsystem monitors temperature, voltage levels and the state of the global address pins. this data is periodically outputted on the serial port. the fo rmat of these messages is detailed in appendix c. at this time the software does not provide support fo r the ipmi functionality (configuration, status, command messages) and does not support the conf iguration of the zl60304 devices. a carrier board must ignore the lack of i 2 c messages and unconditionally activate the target power, 12 volts. in the absence of software to control the device configur ations, the zarlink card should be configured as follows: connector j2 (pins) jumper present 3 to 4 mmc bypass is active sw4 dip switch position 1 not connected 2 down - u1 tx_dis false 3 up - u1 sq_en true 4 up - u1 rx_en true 5 not connected 6 down - u2 tx_dis false 7 up - u2 sq_en true 8 up - u2 rx_en true h8 2168 jtag pwr mgt dip switches dc dc dc dc dc dc dc dc zl xcvr zl xcvr fabric l i n e i o a m c 1 7 0
ZLE60400 user guide 12 zarlink semiconductor inc. 2.4 supplied and optional accessories the following items are supplied with each ZLE60400 card . notify zarlink immediately if any of the items listed below are not received. ? serial "y" cable ? cd - containing manual and schematic the following items are available as optional accessories and can be purchased separately. rapidfet software - the leader in rapi dio configuration and management solutions. www.fetacorp.com ? amc8548 powerpc amc card with optional lrdk (linux rapidio development kit) for open source linux- complete toolkit with phone support and no license ? amc breakout board- provides amc to sma signals ? amc loopback board- allows for amc port testing ? ssrp - switchless carrier reference platform for compliance testing (riolab) contact stx for availability and pricing. www.silicontkx.com 3.0 ZLE60400 connect ivity & configuration this section contains general set-up information about the ZLE60400 advance mezzanine card. refer to figure 2 for jumper and switch locations. 3.1 field configuration 3.1.1 bypass (mmc control disable) when the bypass jumper j2 pins 3 to 4 is present the mmc and zl60304 are reset after power on. the tx_en is true and the sw1 dip switches control tx_dis, sq_en and rx_en. when the bypass jumper is absent, the mmc has reset and configuration control of the signals. without mmc intervention, the zarlink devices may not come out of reset. 3.1.2 spare the presents of jumper j3 pins 1 & 2, provides a direct input to the mmc. its function depends on the version of mmc software. 3.1.3 mmc flash write enable (not) the presents of jumper j2 pins 3 & 4 dis ables the mmc flash from being written to. 3.1.4 eerpom write enable the presents of jumper j3 pins 3 & 4 enabl es the eeprom so that it can be written to.
ZLE60400 user guide 13 zarlink semiconductor inc. 3.1.5 sw1 dip switches if the bypass jumper is present (j2 pi n 3 to 4), then these switches control the configuration options of the zl60304 devices. a switch in the down position (t oward the card) is in the closed position. table 7 - switch 1 settings 4.0 ZLE60400 schematic the ZLE60400 design can be customized for optimal flexibility and custom interfaces so the embedded systems engineer can obtain a lower overall parts costs using a variety of fixed and user selectable options. these options inherently are contained in connectors and jumpers. the schematic provides guidelines for using the install ed and user modifiable options available on the present design as well as suggestions on customer designs that are available on request. switch down/closed up/open 1 not connected not connected 2u1 tx-dis false u1 tx-dis true 3u1 sq-en false u1 sq_en true 4u1 rx-en false u1 rx_en true 5 not connected not connected 6u2 tx-dis false u2 tx-dis true 7u2 sq-en false u2 sq_en true 8 u2 rx_en false u2 rx_en true
ZLE60400 user guide 14 zarlink semiconductor inc. appendix a amc.0 pin naming convention the basic connector only connects to contact fing ers on component side 1; the extended amc connector connects to both sides of the amc module pcb. co mpared to the extended connector, the basic connector provides a cost advantage for the connector and saves real estate on the carrier board. amc connector contact definitions have been made such th at the indispensable connections are implemented in the basic side. connections for addition al differential pair signals have been implemented in the extended side, they are only available in the extended connectors. the basic connectors have been designated as b and ab, while the extended connectors have been designated as b+ and a+b+. functional contact list: basic side functional contact list: extended side basic side (amc module component side 1) power 2, 9, 18, 27, 42, 57, 72, 84 ground 1, 7, 10, 13, 16, 19, 22, 25, 28, 31, 34, 37, 40, 43, 46, 49, 52, 55, 58, 61, 64, 67, 70, 73, 76, 79, 82, 85 general purpose 3, 4, 5, 6, 8, 17, 26, 41, 56, 71, 83 differential pairs 11/12, 14/15, 20 /21, 23/24, 29/30, 32/33, 35/36, 38/39, 44/45, 47/48, 50/51, 53/54, 59/60, 62/63, 65/66, 68/69, 74/75, 77/78, 80/81 extended side (amc module component side 2) power none ground 86, 89, 92, 95, 98, 101, 104, 107, 110, 113, 116, 119, 122, 125, 128, 131 , 134, 137, 140, 143, 146, 149, 152, 155, 158, 161, 164, 170 general purpose 165, 166, 167, 168, 169 differential pairs 87/88, 90/91, 93/94, 96/97, 99/100, 102/103, 105/106, 108/109, 111/112, 114/115, 117/118, 120/121, 123/124, 126/127, 129/130, 132/133, 135/136, 138/139, 141/142, 144/145, 147/148, 150/151, 153/154, 156/157, 159/160, 162/163
ZLE60400 user guide 15 zarlink semiconductor inc. figure 4 - amc edge card pin location
ZLE60400 user guide 16 zarlink semiconductor inc. appendix b references zarlink zl 60304 data sheet (www.zarlink.com) amc.0 - advanced mezzanine card specifications (www.picmg.org) amc.4 - serial rio on amc (www.picmg.org) ipmi - intelligent platform management interface (www.intel.com/design/servers/ipmi) stx ZLE60400 schematic and layout
ZLE60400 user guide 17 zarlink semiconductor inc. appendix c mmc serial port diagnostic messages this message is printed once per second. numbers are in hex format. h07 l00 z00 sw-open t1i=23 t1e=80 t2i=1f t2e=80 00 82 81 ? "h07 l00 z00" is the global address status ? "sw-open" is the state of switch sw3, the handle switch ? "t1i=23 t1e=80 t2i=1f t2e=80" are the internal and external temperature sensor readings in degrees celsius. "80" means there was an error reading the sensor. ? "00 82 81" are the voltage readings, gnd, ? of ipmi_3v3, ? of 3v3 relative to ipmi_3v3. the readings in this example are: not inserted in a carrier board, handle open, 350c/error/310c/error, and half voltages of just over 1.65 volts.
www.zarlink.com information relating to products and services furnished herein by zarlink semiconductor inc. or its subsidiaries (collectively ?zarlink?) is believed to be reliable. however, zarlink assumes no liability for errors that may appear in this publication, or for liability otherwise arising from t he application or use of any such information, product or service or for any infringement of patents or other intellectual property rights owned by third parties which may result from such application or use. neither the supply of such information or purchase of product or service conveys any license, either express or implied, u nder patents or other intellectual property rights owned by zarlink or licensed from third parties by zarlink, whatsoever. purchasers of products are also hereby notified that the use of product in certain ways or in combination with zarlink, or non-zarlink furnished goods or services may infringe patents or other intellect ual property rights owned by zarlink. this publication is issued to provide information only and (unless agreed by zarlink in writing) may not be used, applied or re produced for any purpose nor form part of any order or contract nor to be regarded as a representation relating to the products or services concerned. the products, t heir specifications, services and other information appearing in this publication are subject to change by zarlink without notice. no warranty or guarantee express or implied is made regarding the capability, performance or suitability of any product or service. information concerning possible methods of use is provided as a guide only and does not constitute any guarantee that such methods of use will be satisfactory in a specific piece of equipment. it is the user?s responsibility t o fully determine the performance and suitability of any equipment using such information and to ensure that any publication or data used is up to date and has not b een superseded. manufacturing does not necessarily include testing of all functions or parameters. these products are not suitable for use in any medical products whose failure to perform may result in significant injury or death to the user. all products and materials are sold and services provided subject to zarlink?s conditi ons of sale which are available on request. purchase of zarlink?s i 2 c components conveys a licence under the philips i 2 c patent rights to use these components in and i 2 c system, provided that the system conforms to the i 2 c standard specification as defined by philips. zarlink, zl and the zarlink semiconductor logo are trademarks of zarlink semiconductor inc. copyright zarlink semiconductor inc. all rights reserved. technical documentation - not for resale for more information about all zarlink products visit our web site at

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